New performance standards for flexible and rigid packaging

BorPure™ is a family of high-purity grades for demanding flexible and rigid packaging applications. Enabled by Borstar® Nextension Technology, the materials in this portfolio set new standards for organoleptic performance and also offer outstanding flow properties. This groundbreaking proprietary technology also drives plastics circularity by simplifying Design for Recycling.

  • Flexible packaging and non-woven materials: Grades that can be tailored to suit a range of applications, with properties including superior optics and surface functionality, high purity, and sealing and bonding. The result is a spectrum of differentiated solutions that can be used in a variety of industries, such as consumer products, healthcare, automotive and flexible packaging.
  • Rigid Packaging: Multimodal polyolefin solutions that offer excellent organoleptic properties, high transparency, excellent gloss, and robust hinge performance. They are ideal for one-piece closure applications and can be used in injection molding and compression molding processes

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